Hi-Speed Board Design for Signal Integrity
& EMC Compliance + PCB Layout Design Rules

הקורס שיאפשר למהנדסי אלקטרוניקה להצליח במבחני קבלת מישרת פיתוח וניהול פרויקט

ולמהנדסי חומרה להצליח בפרויקט בסבב הראשון – Right the First Time

Hands on Training Signal  Integrity with Hyperlynx/MentorGraphics


    ששה ימי קורס

  יום תירגול סימולציות מתנה לכל נירשם


 יש מחזורים של יום בשבוע    *   יש מחזורים של יומיים בשבוע

מועבר במכללת טכנולוגיות הייטק, 10 דקות הליכה מרכבת הרצליה, מדינת היהודים 99, הרצליה-פיתוח

ניתן ללימוד כקורס פנימי בכל חברה בכל מקום בישראל, ולקבוצות מתארגנות מ 10 לומדים בבחיפה, בירושלים, אשדוד, באר-שבע, יוקנעם

מועדי הקורס

 לממלא פרטים מדויקים   “צור קשר” יישלח אימייל תוכנית הקורס, מועדי הקורס ועלות


שלום  שלומי  זיגדון

  *   EDI CON  at Santa Clara & Boston, USA

Chairman –  IEEE  EMC & SIPI

[Signal Integrity & Power Integrity for Board Designers]

Committee Member writing Standards:

    IPC-2251 Hi-Speed Board Design Standard

 IPC-2221  PCB Design Standard

 מנהל המכללה, מהנדס אלקטרוניקה, B.Sc. בוגר הטכניון 1981

נסיון קודם: מנכ”ל  וסמנכ”ל מו”פ בחברת סטארט-אפ ROFEH-SIMULATIONS,

  • מהנדס-פתוח בתע”א, מנהל פיתוח והנדסה בכור-אלקטרוניקה, מנהל הנדסת ועריכת מעגלים-מודפסים באלביט.
  • יועץ למשרד הבטחון, רפא”ל, אלתא, מב”ת לווינים, אלביט, אינטל, לקוחות בארה”ב
  • נסיון מעשי של כל התהליך מפיתוח ותכנון אלקטרוני דרך הנדסה ועריכת מאות מעגלים מודפסים.
  • הרצאות בשנים 1995-2008 במכללות: הי-טק/מטריקס, ג’ון-ברייס, סלע, מדיאטק
  • דיפלומת IPC-DC-C.I.D. – מוסמך ללמד אנשי פיתוח והנדסה – תכנון BOARD/PCB DESIGN מ 2002
  • דיפלומת IPC-A-610  – מוסמך להדריך אנשי הנדסה וייצור בנושא יצור הרכבה והלחמה ובקרת איכות (2008-2009)
  • יועץ לחברות הי-טק בתחומי תכנון מעגלים-מודפסים לתדר גבוה ולהגנה בפני EMI


Terms & Definition of Signal Integrity & Power Integrity

Board Design vs. PCB Design

The Hidden Snakes [Parasitic Inductors & Capacitors] in your Paradise [Schema]

The biggest Snake in your Power Planes [the return current path]

E.L Transmission Electric Length vs. Conductors Length

Lumped vs Distributed Conductor

Types of Signal Integrity Problems

The Switching Time and Band-Width Connection

What is a Wave really? the electromagnetic Wave?

The Main Problems of our Design Realization

Sources of Problems

Return Current Path Possibilities

2.1. Rise time & Fall Time Switching Return Current

2.2. Return Current Path of Signal Closed to GND or Closed to VCC Plane

2.3. Microstrip and Stripline difference of Signal propagation

2.4. Return Current distribution Calculation

2.5. Return current for a single-ended

Return current in differential pairs

The role of the Bypass Capacitor

The Stitching Via

Transmision Line Theory & Practical

The Impedance Meaning for Digital Signal

Characteristic Impedance of Conductor

Why 50 Ohm?

Stripline vs. Microstrip Calculation

Co-planar Waveguide

Analog Designs

Design rules for Analog and Power Supply

Hi-Current Conductors Calculation

Hi-Voltage Conductors Calculation

Placement and Routing Rules for Analog PCBs

IPC-2221 Standards main Topic

IPC—2223 Flex PCBs Design rules

DC vs. AC in Digital Circuits

Moving from Kirchhoff & Ohms Laws to Maxwell Equations

Maxwell in Simple words

Fourier Transportation

Time Axis vs. Frequency Axis

The Signal as an Electromagnet Wave

The Spectrum of a Clock Signal

Harmonics structure of a Digital Random Signal

Reflections & Terminations

The physics of Reflection

The Impedance Matching

Reflection Coefficient and Lattice Diagram

When Termination is not a must

Termination Calculation and Advantages for Series, Parallel and Thevenin Terminations

The Diodes and Active Terminations

ODT/OCT operation

Practical Tips for Terminations Placement


Conductors as 3D Antennas

Mechanism of Crosstalk

Capacitive and Inductive Coupling

NEXT and FEXT Crosstalk Diagram and Volume Calculation

Why inductive is stronger than Capacitive

PCB Layout Tips to reduce Crosstalk

PCB Manufacturing Process

The Basic Materials type of basic

Terms: Onze, Clad, Tg, Td, CTE,

Glass-Epoxy Types

Tangent Delta Dissipation Factor

Dielectric Losses of isolators

Delta Dissipation Factor

Tolerances of Dielectric Thickness

Influence of Electroplating on Impedance of Conductors

The Roughness

The Process: from Gerber to PCB

Test Coupon Types and purpose

The content of Gerber & Manufacturing File


HDI – Hi Density PCBs Design Options

Packages Types of ICs

The miniaturization Evolution

The BGA Revolution

microBGA and CSP Advantages and Disadvantages

Basic rules for Footprint Design

Basic Fundamentals – Channel Design 1-10 Gbps

10.1.Frequency domain modeling of interconnections

10.2.Hi-Speed Problems: Reflections, Crosstalk, EMI,

10.3.Multigiga Problems: Skin Effect, Dielectric materials, Vias

10.4.Dissipation Factor of PCB Materials

10.5.Dielectric Losses of isolators

10.6.Via-Model and effects

10.7.Estimating the Total Inductance of Via

the concept of the BER

Laser Via-in-Pad and Backdrilling

11.               PCB Splitting Planes in Mixed Analog/ Digital Boards

11.1.Alternatives for Splitting

11.2.Mixed Analog & Digital Grounding Methods

11.3.Splitting Targets – Advantages & Disadvantages

11.4.Power planes Design Mixed Signals, A/D, DC/DC

Return Current path  for Signals crossing spitted  plane

Power Integrity Problems & Solutions

12.1.  Ground Bounce/SSO/SSN

12.2.  Total inductance and the return path

12.3.  Design of Power Distribution Networks for High-speed Systems

Power Distribution Vias, Planes, Bypass Capacitors

12.5.  Controlling parallel resonance peaks12.6.  Capacitor value selection

12.7.  Designing for Acceptable Ground Bounce/SSO/SSN

12.8.  Return path control

12.9.  Establishing target impedances

12.10.  Capacitors and mounting

12.11.  Minimizing ground bounce in  planes

VCC-GND planes tips to improve PDN by PCB Design

High speed serial links and differential pairs

Differential Pairs

Designing differential circuits

Routing rules

Differential impedance when uncoupled

Design Rules for differential conductors


EMI/EMC Theory & Terms

Common & Differential Mode radiation

Military and Industrial Standards

ESD-Principals of ESD buildup. Characteristics,

penetration to electronics. Latent effects.

Mitigation of ESD effects.

Practical Design of PCB

Faraday Cage Design in PCB

Layers Construction

Comparing 2,4,6,8,10,12,14,16,18,20 Layers

20H rule of Power Planes

The Best Multilayer construction for EMC

The Real world of Passive Component

The Capacitor Practical Model


Capacitor role as: Decoupling, Bypassing,

Filtering, Current Source, Bulk

The Inductor Practical Model

The Resistor Practical Model

Calculation and placement on PCB

Grounding in PCB

The Chassis Role

Design Rules for Chassis

Methods of Chassis to GND Plane connection

Jitter Basics & Measurements

Causes of Random Jitter

Causes of Periodic Jitter

Causes of Data Dependent Jitter

Cycle-to-Cycle Jitter

TIE vs. Period Jitter vs. Cycle-to-Cycle

Advanced Oscilloscope Eye Pattern Measurement Demonstration

Eye Pattern & Lossy Lines

Lossy Lines Fundamentals

Skin Effect of conductors – DC & AC Resistance

Dielectric Losses – Loss Tangent

Copper Roughness influence

Lossy Line Considerations

Special PCB materials comparison

Multigiga Signals Routing rules

Multigigabit Differentials Communication

PCIexpress Routing Rules


Rules for Data rates of 1 – 10 Gbps

CPU/FPGA to DDRX Memory Layout Design Considerations

Considerations for DDR Memory Interfaces

Recommended Design Rules and Strategies for BGA/uBGA/CSP Devices

LPDDR3/4/x Routing Rules for Mobile Devices

Real PCB Layout Test Case

Pre-Emphasis & Equalization

Pre-Emphasis  and De-Emphasis Solutions

Equalization Principles and Solutions

Tightly / Loosely Coupling Routing Rules

PCB Layout Rules

Power Supply PCB

Sensitive Analog PCB

Digital PCB


101 Rules Summery

Rules of Thumb

PCB Layout Rules for Signal Integrity

Rules fo Power Integrity & EMC

Hands On Training Simulations

10-20 Layers PCB Design

Transmision Line Simulations

Measuring Reflections on Osciloscope

Choosing the Termination Type and Value

Crosstalk Measurements

Field Solver – Visually and Data

Preventing Crosstalk

EMI Radiation Measurement

Diploma – 64 Hours Course