Hi-Speed Board Design for Signal Integrity
& EMC Compliance + PCB Layout Design Rules

הקורס שיאפשר למהנדסי אלקטרוניקה להצליח במבחני קבלת מישרת פיתוח וניהול פרויקט

ולמהנדסי חומרה להצליח בפרויקט בסבב הראשון – Right the First Time

Hands on Training Signal  Integrity with Hyperlynx/MentorGraphics

מתכונת

    ששה ימי קורס

  יום תירגול סימולציות מתנה לכל נירשם

9:30-16:30

 יש מחזורים של יום בשבוע    *   יש מחזורים של יומיים בשבוע

מועבר במכללת טכנולוגיות הייטק, 10 דקות הליכה מרכבת הרצליה, מדינת היהודים 99, הרצליה-פיתוח

ניתן ללימוד כקורס פנימי בכל חברה בכל מקום בישראל, ולקבוצות מתארגנות מ 10 לומדים בבחיפה, בירושלים, אשדוד, באר-שבע, יוקנעם

מועדי הקורס

 לממלא פרטים מדויקים   “צור קשר” יישלח אימייל תוכנית הקורס, מועדי הקורס ועלות

מרצה

שלום  שלומי  זיגדון

  *   EDI CON  at Santa Clara & Boston, USA

Chairman –  IEEE  EMC & SIPI

[Signal Integrity & Power Integrity for Board Designers]

Committee Member writing Standards:

    IPC-2251 Hi-Speed Board Design Standard

 IPC-2221  PCB Design Standard

 מנהל המכללה, מהנדס אלקטרוניקה, B.Sc. בוגר הטכניון 1981

נסיון קודם: מנכ”ל  וסמנכ”ל מו”פ בחברת סטארט-אפ ROFEH-SIMULATIONS,

  • מהנדס-פתוח בתע”א, מנהל פיתוח והנדסה בכור-אלקטרוניקה, מנהל הנדסת ועריכת מעגלים-מודפסים באלביט.
  • יועץ למשרד הבטחון, רפא”ל, אלתא, מב”ת לווינים, אלביט, אינטל, לקוחות בארה”ב
  • נסיון מעשי של כל התהליך מפיתוח ותכנון אלקטרוני דרך הנדסה ועריכת מאות מעגלים מודפסים.
  • הרצאות בשנים 1995-2008 במכללות: הי-טק/מטריקס, ג’ון-ברייס, סלע, מדיאטק
  • דיפלומת IPC-DC-C.I.D. – מוסמך ללמד אנשי פיתוח והנדסה – תכנון BOARD/PCB DESIGN מ 2002
  • דיפלומת IPC-A-610  – מוסמך להדריך אנשי הנדסה וייצור בנושא יצור הרכבה והלחמה ובקרת איכות (2008-2009)
  • יועץ לחברות הי-טק בתחומי תכנון מעגלים-מודפסים לתדר גבוה ולהגנה בפני EMI

SYLLABUS

  1. Terms & Definition of Signal Integrity & Power Integrity
    • Board Design vs. PCB Design
    • The Hidden Snakes [Parasitic Inductors & Capacitors] in your Paradise [Schema]
    • The biggest Snake in your Power Planes [the return current path]
    • E.L Transmission Electric Length vs. Conductors Length
    • Lumped vs Distributed Conductor
    • Types of Signal Integrity Problems
    • The Switching Time and Band-Width Connection
    • What is a Wave really? the electromagnetic Wave?
    • The Main Problems of our Design Realization
    • Sources of Problems
  1. Return Current Path Possibilities
2.1. Rise time & Fall Time Switching Return Current

2.2. Return Current Path of Signal Closed to GND or Closed to VCC Plane

2.3. Microstrip and Stripline difference of Signal propagation

2.4. Return Current distribution Calculation

2.5. Return current for a single-ended

  • Return current in differential pairs
  • The role of the Bypass Capacitor
  • The Stitching Via
  1. Transmision Line Theory & Practical
    • The Impedance Meaning for Digital Signal
    • Characteristic Impedance of Conductor
    • Why 50 Ohm?
    • Stripline vs. Microstrip Calculation
    • Co-planar Waveguide
  2. Analog Designs
    • Design rules for Analog and Power Supply
    • Hi-Current Conductors Calculation
    • Hi-Voltage Conductors Calculation
    • Placement and Routing Rules for Analog PCBs
    • IPC-2221 Standards main Topic
    • IPC—2223 Flex PCBs Design rules
  1. DC vs. AC in Digital Circuits
    • Moving from Kirchhoff & Ohms Laws to Maxwell Equations
    • Maxwell in Simple words
    • Fourier Transportation
    • Time Axis vs. Frequency Axis
    • The Signal as an Electromagnet Wave
    • The Spectrum of a Clock Signal
    • Harmonics structure of a Digital Random Signal
  1. Reflections & Terminations
    • The physics of Reflection
    • The Impedance Matching
    • Reflection Coefficient and Lattice Diagram
    • When Termination is not a must
    • Termination Calculation and Advantages for Series, Parallel and Thevenin Terminations
    • The Diodes and Active Terminations
    • ODT/OCT operation
    • Practical Tips for Terminations Placement
  2. Crosstalk
    • Conductors as 3D Antennas
    • Mechanism of Crosstalk
    • Capacitive and Inductive Coupling
    • NEXT and FEXT Crosstalk Diagram and Volume Calculation
    • Why inductive is stronger than Capacitive
    • PCB Layout Tips to reduce Crosstalk
  1. PCB Manufacturing Process
    • The Basic Materials type of basic
    • Terms: Onze, Clad, Tg, Td, CTE,
    • Glass-Epoxy Types
    • Tangent Delta Dissipation Factor
    • Dielectric Losses of isolators
    • Delta Dissipation Factor
    • Tolerances of Dielectric Thickness
    • Influence of Electroplating on Impedance of Conductors
    • The Roughness
    • The Process: from Gerber to PCB
    • Test Coupon Types and purpose
    • The content of Gerber & Manufacturing File
    • EMBEDDED RESISTORS & CAPACITORS
    • HDI – Hi Density PCBs Design Options
  2. Packages Types of ICs
    • The miniaturization Evolution
    • The BGA Revolution
    • microBGA and CSP Advantages and Disadvantages
    • Basic rules for Footprint Design
  1. Basic Fundamentals – Channel Design 1-10 Gbps
10.1.Frequency domain modeling of interconnections

10.2.Hi-Speed Problems: Reflections, Crosstalk, EMI,

10.3.Multigiga Problems: Skin Effect, Dielectric materials, Vias

10.4.Dissipation Factor of PCB Materials

10.5.Dielectric Losses of isolators

10.6.Via-Model and effects

10.7.Estimating the Total Inductance of Via

  • the concept of the BER
  • Laser Via-in-Pad and Backdrilling
11.               PCB Splitting Planes in Mixed Analog/ Digital Boards

11.1.Alternatives for Splitting

11.2.Mixed Analog & Digital Grounding Methods

11.3.Splitting Targets – Advantages & Disadvantages

11.4.Power planes Design Mixed Signals, A/D, DC/DC

  • Return Current path  for Signals crossing spitted  plane
  1. Power Integrity Problems & Solutions
12.1.  Ground Bounce/SSO/SSN

12.2.  Total inductance and the return path

12.3.  Design of Power Distribution Networks for High-speed Systems

  • Power Distribution Vias, Planes, Bypass Capacitors
12.5.  Controlling parallel resonance peaks

12.6.  Capacitor value selection

12.7.  Designing for Acceptable Ground Bounce/SSO/SSN

12.8.  Return path control

12.9.  Establishing target impedances

12.10.  Capacitors and mounting

12.11.  Minimizing ground bounce in  planes

  • VCC-GND planes tips to improve PDN by PCB Design
  1. High speed serial links and differential pairs
    • Differential Pairs
    • Designing differential circuits
    • Routing rules
    • Differential impedance when uncoupled
    • Design Rules for differential conductors
  1. EMI in PCBs
    • EMI/EMC Theory & Terms
    • Common & Differential Mode radiation
    • Military and Industrial Standards
    • ESD-Principals of ESD buildup. Characteristics,
    • penetration to electronics. Latent effects.
    • Mitigation of ESD effects.
    • Practical Design of PCB
    • Faraday Cage Design in PCB
    • Layers Construction
    • Comparing 2,4,6,8,10,12,14,16,18,20 Layers
    • 20H rule of Power Planes
    • The Best Multilayer construction for EMC
  1. The Real world of Passive Component
    • The Capacitor Practical Model
    • ESR & ESL
    • Capacitor role as: Decoupling, Bypassing,
    • Filtering, Current Source, Bulk
    • The Inductor Practical Model
    • The Resistor Practical Model
    • Calculation and placement on PCB
  1. Grounding in PCB
    • The Chassis Role
    • Design Rules for Chassis
    • Methods of Chassis to GND Plane connection
  1. Jitter Basics & Measurements
    • Causes of Random Jitter
    • Causes of Periodic Jitter
    • Causes of Data Dependent Jitter
    • Cycle-to-Cycle Jitter
    • TIE vs. Period Jitter vs. Cycle-to-Cycle
    • Advanced Oscilloscope Eye Pattern Measurement Demonstration
  2. Eye Pattern & Lossy Lines
    • Lossy Lines Fundamentals
    • Skin Effect of conductors – DC & AC Resistance
    • Dielectric Losses – Loss Tangent
    • Copper Roughness influence
    • Lossy Line Considerations
    • Special PCB materials comparison
  3. Multigiga Signals Routing rules
    • Multigigabit Differentials Communication
    • PCIexpress Routing Rules
    • USB2/USB3
    • Rules for Data rates of 1 – 10 Gbps
  4. CPU/FPGA to DDRX Memory Layout Design Considerations
    • Considerations for DDR Memory Interfaces
    • Recommended Design Rules and Strategies for BGA/uBGA/CSP Devices
    • LPDDR3/4/x Routing Rules for Mobile Devices
    • Real PCB Layout Test Case
  1. Pre-Emphasis & Equalization
    • Pre-Emphasis  and De-Emphasis Solutions
    • Equalization Principles and Solutions
    • Tightly / Loosely Coupling Routing Rules
  1. PCB Layout Rules
    • Power Supply PCB
    • Sensitive Analog PCB
    • Digital PCB
    • DFM/DFA/DFT
  2. 101 Rules Summery
    • Rules of Thumb
    • PCB Layout Rules for Signal Integrity
    • Rules fo Power Integrity & EMC
  3. Hands On Training Simulations
    • 10-20 Layers PCB Design
    • Transmision Line Simulations
    • Measuring Reflections on Osciloscope
    • Choosing the Termination Type and Value
  4. Crosstalk Measurements
    • Field Solver – Visually and Data
    • Preventing Crosstalk
    • EMI Radiation Measurement
  5. Diploma – 64 Hours Course